Xfp 10g Stm-64/10gbps/10ge - 40km 1550nm

Xfp 10g Stm-64/10gbps/10ge – 40km 1550nm

R$1.199,00

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XFP

Features

  • Supports 9.95Gb/s to 11.1Gb/s bit rates
  • Hot-pluggable XFP foot print
  • Maximum link lengthof 40km with SMF
  • 1550nm Uncooled EML laser and PIN photodiode
  • XFP MSA package with duplex LC connector
  • No reference clock required
  • 5V, 3.3V power supply
  • Power dissipation<2.5W
  • Compatible with RoHS
  • Built-in digital diagnostic functions
  • Temperature range 0°C to 70°C

Applications 

  • SDH STM I-64.2 at 9.953Gbps
  • 10GBASE-LR/LW 10G Ethernet
  • 1200-SM-LL-L 10G Fibre Channel
  • 10GE over G.709 at 11.09Gbps
  • OC192 over FEC at 10.709Gbps
  • Other optical links, upto 11.1Gbps 

Description 

XFP is compliant with the 10G Small Form-Factor Pluggable (XFP) Multi-Source Agreement (MSA), supporting data-rate of 10.3125Gbps(10GBASE-LR) or 9.953Gbps 10GBASE-LW), and transmission distance up to 10km on SMF.

The transceiver module comprises a transmitter with 1310nm uncooled EML laser and a receiver with a PIN photodiode. Transmitter and receiver are separate within a wide temperature range of 0to 70 and offers optimum heat dissipation and excellent electro magnetic shielding thus enabling high port densities for 10 GbE systems. 

Absolute Maximum Ratings  

Parameter Symbol  Min  Max  Unit  Ref.
Storage Ambient Temperature Range -40 85
Powered case Temperature Range 0 75
Operating Relative Humidity RH 80
Supply Voltage Range @5V Vcc5 -0.5 6.0 V
Supply Voltage Range @ 3.3V Vcc3 -0.5 4.0 V

 

Any stress beyond the maximum ratings can result in permanent damage. The device specifications are guaranteed only under there commended operating conditions.

Electrical Characteristics

  

Parameter Symbol Min Typ Max Unit Note
Operating Case Temperature Range Tc 0 70
Power Supply Voltage @ 5V Vcc5 4.75 5.0 5.25 V
Power Supply Voltage @ 3.3V Vcc3 3.13 3.3 3.47 V
Module total power P 2.5 W
Transmitter
Input differential impedance Rin 100 Ω 1
Differential data input swing Vin,pp 120 820 mV
Transmit Disable Voltage VD 2.0 Vcc V
Transmit Enable Voltage VEN GND GND 0.8 V
Transmit Disable Assert Time 10 us
Receiver
Differential data output swing Vout,pp 500 850 mV
Data output rise time tr 38 ps 2
Data output fall time tf 38 ps 2
LOS Fault VLOS fault Vcc – 0.5 VccHOST V 3
LOS Normal VLOS norm GND GND 0.5 V 3
Power Supply Rejection PSR See Note 3 below 4

 Notes:

 1. Afterinternal AC coupling.

 2. 20 – 80 %

 3. Loss Of Signalis open collector to be pulled up with a 4.7k – 10kohm resistor to 3.15 – 3.6V. Logic 0 indicates normal operation; logic 1 indicates no signal detected.

 4. Per Section 2.7.1. in the XFP MSA Specification.

Optical Characteristics 

Parameter Symbol Min Typ Max Unit Ref.
Transmitter
Optical output Power P -1.0 2.0 dBm
Optical Wavelength λ 1270 1600 nm
Side Mode Suppression Ratio SMSR 30 dB
Optical Extinction Ratio ER 6 dB 1
Average Launch power of OFF transmitter POFF -30 dBm
Tx Jitter Txj Compliant with each standard requirements
Receiver
Receiver Sensitivity RSENS -16 -14.0 dBm 2
Receiver Sensitivity in OMA RSENS -12.3 dBm 2
Maximum Input Power PMAX 0.5 dBm
Optical Center Wavelength λC 1260 1600 nm
LOS De-Assert LOSD -15 dBm
LOS Assert LOSA -25 dBm
LOS Hysteresis 1 4 dB

 Notes:

 1, PRBS 231-1 test pattern @10.3125Gbps.

 2, PRBS 231-1 test pattern @10.3125Gbps, BER≤10-12.

 Pin Descriptions

Pin Logic Symbol Name/Description Ref
1 GND Module Ground 1
2 VEE5 Optional –5.2 Power Supply – Notrequired
3 LVTTL-I Mod-Desel Module De-select; When held lowal lows the module to, respond to 2-wire serial interface commands  
4 LVTTL-O Interrupt Interrupt (bar); Indicates presence of an important condition which can be read over the serial 2-wire interface 2
5 LVTTL-I TX_DIS Transmitter Disable; Transmitter laser source turned off  
6 VCC5 5 Power Supply
7 GND Module Ground 1
8 VCC3 3.3V Power Supply
9 VCC3 3.3V Power Supply
10 LVTTL-I SCL Serial 2-wire interface clock 2
11 LVTTL- I/O SDA Serial 2-wire interface data line 2
12 LVTTL-O Mod_Abs Module Absent; Indicates module is not present. Grounded in the module. 2
13 LVTTL-O Mod_NR Module Not Ready; 2
14 LVTTL-O RX_LOS Receiver Loss of Signal indicator 2
15 GND Module Ground 1
16 GND Module Ground 1
17 CML-O RD- Receiver inverted data output
18 CML-O RD Receiver non-inverted data output  
19 GND Module Ground 1
20 VCC2 1.8V Power Supply – Not required
21 LVTTL-I P_Down/RST Power Down; When high, places the module in the low power stand-by mode and on the falling edge of P_Down initiates a module reset  
Reset; The falling edge initiates a complete reset of the module including the 2-wire serial interface, equivalent to a power cycle.  
22 VCC2 1.8V Power Supply – Not required
23 GND Module Ground 1
24 PECL-I RefCLK Reference Clock non-inverted input, AC coupled on the host board – Not required 3
25 PECL-I RefCLK- Reference Clock inverted input, AC coupled on the host board – Not required 3
26 GND Module Ground 1
27 GND Module Ground 1
28 CML-I TD- Transmitter inverted data input
29 CML-I TD Transmitter non-inverted data input  
30 GND Module Ground 1

 Notes: 

 1. Module circuit ground is isolated from module chassis ground within the module.

 2. Open collector; should be pulled up with 4.7k – 10k ohms on host board to a voltage between 3.15Vand 3.6V.

 3. A Reference Clock input is not required.  

Hostboard Connector Pinout

General Specifications   

Parameter Symbol  Min  Typ  Max  Units  Ref.
Bit Rate BR 9.95 11.1 Gb/s 1
Bit Error Ratio BER 10-12 2
Max. Supported Link Length LMAX 10 km 1

 Notes:

 1. SONET OC-192 SR-1SDH STM I-64.1 ,10GBASE-LR/LW, 1200-SM-LL-L

 2. Tested with a 231 – 1 PRBS  

Management Interface

 The transceivers provide serial ID memory contents and diagnostic information about the present operating conditions by the 2-wire serial interface (SCL, SDA).

 The Module provides diagnostic information about the present operating conditions. The transceiver generates this diagnostic data by digitization of internal analog signals. Alarm/warning threshold data is written during device manufacture. Received power monitoring, transmitted power monitoring, bias current monitoring, supply voltage monitoring and temperature monitoring all are implemented.

 The digital diagnostic memory map specific data field defines as following.

 

Recommended Host Board Power Supply Circuit

Recommended High-speed Interface Circuit

Mechanical Specifications

 XFP transceivers are compliant with the dimensions defined by the XFP Multi-Sourcing Agreement (MSA).

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